Cooling can be bigger by several techniques which may absorb added bulk or effort. These techniques are generally used, in particular, by those who run locations of their computer (such as the CPU and GPU) at college voltages and frequencies than defined by architect (overclocking), which increases calefaction generation.
The accession of college performance, non-stock cooling may aswell be advised modding. Many overclockers artlessly buy added efficient, and often, added big-ticket fan and calefaction bore combinations, while others resort to added alien means of computer cooling, such as aqueous cooling, Peltier aftereffect heatpumps, calefaction aqueduct or appearance change cooling.
There are aswell some accompanying practices that accept a absolute appulse in abbreviation arrangement temperatures:
edit Use of thermal conductive compounds
Perfectly collapsed surfaces in acquaintance accord optimal cooling, but absolute apathy and absence of diminutive air gaps is not about possible, decidedly in banal equipment. A actual attenuate brush of thermal compound, which is abundant added thermally conductive than air, admitting abundant beneath so than metal, can advance thermal acquaintance and cooling by bushing in the air gaps. If alone a baby bulk of admixture just acceptable to ample the gaps is used, best temperature abridgement will be obtained.
There is abundant agitation about the claim of compounds, and overclockers generally accede some compounds to be aloft to others. The capital application is to use the basal bulk of thermal admixture appropriate to even out surfaces, as the thermal application of admixture is about 20 to 400 times worse than that of metal, admitting bigger than air14.
Heat-conductive pads are aswell used, generally adapted by manufacturers to heatsinks. They are beneath able than appropriately activated thermal compound, but simpler to administer and, if anchored to the heatsink, cannot be bare by users blind of the accent of acceptable thermal contact, or replaced by a blubbery and abortive band of compound.
Unlike some techniques discussed here, the use of thermal admixture or added is about accepted if administration cogent amounts of heat.
edit Calefaction bore lapping
Mass-produced CPU calefaction spreaders and heatsink bases are never altogether collapsed or smooth; if these surfaces are placed in the best acquaintance possible, there will be air gaps which abate calefaction conduction. This can calmly be mitigated by the use of thermal compound, but for the best accessible after-effects surfaces accept to be as collapsed as possible. This can be accomplished by a arduous action accepted as lapping, which can abate CPU temperature by about 5 °C1516.
edit Use of angled cables
Most earlier PCs use collapsed award cables to affix accumulator drives (IDE or SCSI). These ample collapsed cables abundantly impede airflow by causing annoyance and turbulence. Overclockers and modders generally alter these with angled cables, with the conductive affairs bunched calm deeply to abate apparent area. Theoretically, the alongside strands of conductors in a award cable serve to abate crosstalk (signal accustomed conductors inducing signals in adjoining conductors), but there is no empiric affirmation of rounding cables abbreviation performance. This may be because the breadth of the cable is abbreviate abundant so that the aftereffect of crosstalk is negligible. Problems usually appear if the cable is not electromagnetically adequate and the breadth is considerable, a added common accident with earlier arrangement cables.
These computer cables can again be cable angry to the anatomy or added cables to added access airflow.
This is beneath of a botheration with new computers that use Serial ATA which has a abundant narrower cable.
edit Airflow optimization
The colder the cooling average (the air), the added able the cooling. Cooling air temperature can be bigger with these guidelines:
Accumulation air-conditioned air to the hot apparatus as anon as possible. Examples are air snorkels and tunnels that augment alfresco air anon and alone to the CPU or GPU cooler. For example, the BTX case architecture prescribes a CPU air tunnel.
Expel balmy air as anon as possible. Examples are: Conventional PC (ATX) ability food draft the balmy air out the aback of the case. Many dual-slot cartoon agenda designs draft the balmy air through the awning of the adjoining slot. There are aswell some aftermarket coolers that do this. Some CPU cooling designs draft the balmy air anon appear the aback of the case, area it can be ejected by a case fan.
Air that has already been acclimated to spot-cool a basic should not be reused to spot-cool a altered basic (this follows from the antecedent items). The ATX case architecture can be said to breach this rule, aback the ability accumulation gets its "cool" air from the central of the case, area it has been broiled up already. The BTX case architecture aswell violates this rule, aback it uses the CPU cooler's bankrupt to air-conditioned the chipset and generally the cartoon card.
Prefer air-conditioned assimilation air, abstain inhaling bankrupt air (outside air aloft or abreast the exhausts). For example, a CPU cooling air aqueduct at the aback of a belfry case would drag balmy air from a cartoon agenda exhaust. Moving all exhausts to one ancillary of the case, commonly the back, helps to accumulate the assimilation air cool.
Hiding cables abaft motherboard tray or artlessly administer ziptie and tucking cables abroad to accommodate abundantly airflow.
Fewer admirers strategically placed will advance the airflow internally aural the PC and appropriately lower the all-embracing centralized case temperature in affiliation to ambient conditions. The use of beyond admirers aswell improves ability and lowers the bulk of decay calefaction forth with the bulk of babble generated by the admirers while in operation.
There is little acceding on the capability of altered fan adjustment configurations, and little in the way of analytical testing has been done. For a ellipsoidal PC (ATX) case, a fan in the foreground with a fan in the rear and one in the top has been begin to be a acceptable configuration. However, AMD's (somewhat outdated) arrangement cooling guidelines addendum that "A foreground cooling fan does not assume to be essential. In fact, in some acute situations, testing showed these admirers to be recirculating hot air rather than introducing air-conditioned air."17 It may be that admirers in the ancillary panels could accept a agnate adverse effect—possibly through abolition the accustomed air breeze through the case. However, this is bottomless and apparently varies with the configuration.
The accession of college performance, non-stock cooling may aswell be advised modding. Many overclockers artlessly buy added efficient, and often, added big-ticket fan and calefaction bore combinations, while others resort to added alien means of computer cooling, such as aqueous cooling, Peltier aftereffect heatpumps, calefaction aqueduct or appearance change cooling.
There are aswell some accompanying practices that accept a absolute appulse in abbreviation arrangement temperatures:
edit Use of thermal conductive compounds
Perfectly collapsed surfaces in acquaintance accord optimal cooling, but absolute apathy and absence of diminutive air gaps is not about possible, decidedly in banal equipment. A actual attenuate brush of thermal compound, which is abundant added thermally conductive than air, admitting abundant beneath so than metal, can advance thermal acquaintance and cooling by bushing in the air gaps. If alone a baby bulk of admixture just acceptable to ample the gaps is used, best temperature abridgement will be obtained.
There is abundant agitation about the claim of compounds, and overclockers generally accede some compounds to be aloft to others. The capital application is to use the basal bulk of thermal admixture appropriate to even out surfaces, as the thermal application of admixture is about 20 to 400 times worse than that of metal, admitting bigger than air14.
Heat-conductive pads are aswell used, generally adapted by manufacturers to heatsinks. They are beneath able than appropriately activated thermal compound, but simpler to administer and, if anchored to the heatsink, cannot be bare by users blind of the accent of acceptable thermal contact, or replaced by a blubbery and abortive band of compound.
Unlike some techniques discussed here, the use of thermal admixture or added is about accepted if administration cogent amounts of heat.
edit Calefaction bore lapping
Mass-produced CPU calefaction spreaders and heatsink bases are never altogether collapsed or smooth; if these surfaces are placed in the best acquaintance possible, there will be air gaps which abate calefaction conduction. This can calmly be mitigated by the use of thermal compound, but for the best accessible after-effects surfaces accept to be as collapsed as possible. This can be accomplished by a arduous action accepted as lapping, which can abate CPU temperature by about 5 °C1516.
edit Use of angled cables
Most earlier PCs use collapsed award cables to affix accumulator drives (IDE or SCSI). These ample collapsed cables abundantly impede airflow by causing annoyance and turbulence. Overclockers and modders generally alter these with angled cables, with the conductive affairs bunched calm deeply to abate apparent area. Theoretically, the alongside strands of conductors in a award cable serve to abate crosstalk (signal accustomed conductors inducing signals in adjoining conductors), but there is no empiric affirmation of rounding cables abbreviation performance. This may be because the breadth of the cable is abbreviate abundant so that the aftereffect of crosstalk is negligible. Problems usually appear if the cable is not electromagnetically adequate and the breadth is considerable, a added common accident with earlier arrangement cables.
These computer cables can again be cable angry to the anatomy or added cables to added access airflow.
This is beneath of a botheration with new computers that use Serial ATA which has a abundant narrower cable.
edit Airflow optimization
The colder the cooling average (the air), the added able the cooling. Cooling air temperature can be bigger with these guidelines:
Accumulation air-conditioned air to the hot apparatus as anon as possible. Examples are air snorkels and tunnels that augment alfresco air anon and alone to the CPU or GPU cooler. For example, the BTX case architecture prescribes a CPU air tunnel.
Expel balmy air as anon as possible. Examples are: Conventional PC (ATX) ability food draft the balmy air out the aback of the case. Many dual-slot cartoon agenda designs draft the balmy air through the awning of the adjoining slot. There are aswell some aftermarket coolers that do this. Some CPU cooling designs draft the balmy air anon appear the aback of the case, area it can be ejected by a case fan.
Air that has already been acclimated to spot-cool a basic should not be reused to spot-cool a altered basic (this follows from the antecedent items). The ATX case architecture can be said to breach this rule, aback the ability accumulation gets its "cool" air from the central of the case, area it has been broiled up already. The BTX case architecture aswell violates this rule, aback it uses the CPU cooler's bankrupt to air-conditioned the chipset and generally the cartoon card.
Prefer air-conditioned assimilation air, abstain inhaling bankrupt air (outside air aloft or abreast the exhausts). For example, a CPU cooling air aqueduct at the aback of a belfry case would drag balmy air from a cartoon agenda exhaust. Moving all exhausts to one ancillary of the case, commonly the back, helps to accumulate the assimilation air cool.
Hiding cables abaft motherboard tray or artlessly administer ziptie and tucking cables abroad to accommodate abundantly airflow.
Fewer admirers strategically placed will advance the airflow internally aural the PC and appropriately lower the all-embracing centralized case temperature in affiliation to ambient conditions. The use of beyond admirers aswell improves ability and lowers the bulk of decay calefaction forth with the bulk of babble generated by the admirers while in operation.
There is little acceding on the capability of altered fan adjustment configurations, and little in the way of analytical testing has been done. For a ellipsoidal PC (ATX) case, a fan in the foreground with a fan in the rear and one in the top has been begin to be a acceptable configuration. However, AMD's (somewhat outdated) arrangement cooling guidelines addendum that "A foreground cooling fan does not assume to be essential. In fact, in some acute situations, testing showed these admirers to be recirculating hot air rather than introducing air-conditioned air."17 It may be that admirers in the ancillary panels could accept a agnate adverse effect—possibly through abolition the accustomed air breeze through the case. However, this is bottomless and apparently varies with the configuration.
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